Optimization of a Wavy Microchannel Heat Sink with Grooves

In this study, a wavy microchannel heat sink with grooves using water as the working fluid is proposed for application to cooling microprocessors. The geometry of was optimized improve transfer and pressure loss simultaneously. To achieve optimization goals, average friction factor thermal resistance were used objective functions. Three dimensionless parameters selected design variables: distance between staggered grooves, groove width, depth. A modified Latin hypercube sampling (LHS) method that combines advantages conventional LHS three-level full factorial also proposed. Response surface approximation construct surrogate models, Pareto-optimal solutions obtained multi-objective genetic algorithm. proven have better performance than methods in present problem. representative optimal showed both improved by 1.55% 3.00%, compared reference design, respectively.